$KLAC · 海外大V持仓追踪

$KLAC 现在是什么情况？

最近有人说了 $KLAC 什么？

下面是最近 7 条提及 $KLAC 的公开帖，按时间倒序。每条都附原帖链接，可自行核对。

• 2026-05-10中性原文
  “Leading” Glass Substrate players that were name dropped if you’re curious: • $LPK — TGV Equipment • $GLW — Glass Materials • $ASGLY (5201 T)— Glass Materials • $NIDGY (5214 T) — Glass Materials • $LRCX — Etching Systems • $DSCSY (6146 T)— Dicing Equipment • $SMHSF — Bonding Systems • $ONTO — Inspection Tools • $KLAC — Inspection Tools Fun to see the stuff I’ve called out early in the year like LPK at ~$150m MC get mentioned as a critical player by Trendforce and others.
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• 2026-04-26看空
  近期新闻+起飞瓶颈TLDR： 1. CPU瓶颈——$INTC CEO说AI推理把CPU配比从1:8推到了1:1。 CPU起飞（$AMD、英特尔、$ARM）→ $AMAT / $TSM / $KLAC 等跟着起飞。 2. PGME/PGMEA短缺。杜邦、信纮、达兴、三福、$DOW 等起飞？ 光刻胶瓶颈起飞？ 3. 微控制器潜在瓶颈+涨价（雅特力），AI产能挤压下酝酿提价。 MCU公司可能起飞？ 4. 总统本周启动《国防生产法》，包括： ——变压器 ——输电部件 ——先进导体 ——电力电子 ——变电站 ——高压断路器 ——保护继电器、电容器组 ——电工钢 定性为「严重短缺」。$AMSC、$PLPC、$POWL、$VICR、$ATKR、$HPS.A 之类起飞。 5. $GOOGL 上量新TPU服务器，把AI芯片分成训练和推理两条线。 台湾开心。联发科等起飞？ 6. 三星、金士顿SSD提价超10%。 SSD价格继续飞？ 7. T-glass玻璃纤维短缺持续恶化？日东纺等继续飞？ 8. 溴（蚀刻电路和阻燃必需）暴涨到12000美元/吨。 以色列ICL集团据称控制全球40%供应？ 不太熟这块，但值得关注？ 9. 「外延厂商联亚光电称产出仍远低于客户需求」。 呃，$IQE 等起飞？ 10. 「AI数据中心撞上互连极限，推升光模块需求」「瓶颈已不只是算力，而是算力如何被连接」。 光子股 $AAOI、$LITE、$COHR、中际旭创等继续飞？下一代 $SIVE、$POET、$MRVL、稳懋等起飞？ 一句话总结：AI巨头需求导致全面短缺，整个AI半导体供应链都在起飞。
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• 2026-04-23看多原文
  @northyvt I feel like $TSM and OSAT/advanced packaging partners are the main beneficiaries apart from $AMD? Maybe like $AMAT, $LRCX, $KLAC, $ASML and others too? $INTC also have their own fabs that they bought back recently so it's happy.
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• 2026-02-12看多原文
  The "Bottleneck ETF" from supply chain mapping. Not a single name red. Equal weighted results 1W: +12.83%. List: $LITE: +31.68% $AMKR: +28.7% Disco: +24.35% $GLW: +23.57% $COHR: +23.5% $ONTO: +18.4% $CAMT: +17.7% $TSM: +15.8% $ON: +15.8% Samsung: +15.4% $KLAC: +12.7% $APH: +11.6% $MRVL: +11.4% $MU: +10.6% $MOD: +10.6% Sk Hynix: +10.31% $VICR: +9.6% $AVGO: +9.46% $SBGSY: +9.27% $ETN: +9.1% $BESIY: +8.53% $IFNNY: +7.37% $MPWR: +6.85% $SNDK: +6.4% $QLCM: +6.12% $AMD: +6.01% Mediatek: +6% Kioxia: +3.68% $INTC: +1.62% I feel like institutions just bought this entire list from last week's framework? This level of performance is pretty crazy.
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• 2026-02-07看多原文
  Here's my TLDR + mapped into investment framework from Semivision bottleneck summary: HBM: HBM4 (16Hi) - Samsung, Sk Hynix, $MU HBF - $SNDK, Kioxia Base Die - $TSM, Samsung (internal) CPO/photonics; Glass Substrate: $GLW, $INTC, Ibiden Optical: $LITE, $AVGO, $COHR, $MRVL Power Delivery: Volatage: $MPWR, $VICR Thermal: $VRT, $NVT, $MOD Grid: $ETN, $SBGSY SiC/GaN: $ON, $IFNNY Rack: $APH N2 Volume: $TSM , $AMD (First mover dc), $QLCM, Mediatek, $NVDA Advanced Packaging: Yield: $CAMT, $ONTO, $KLAC OSATs: $AMKR $BESIY, Disco Semivision's summary: 1. "advanced packaging capacity and yield control" 2. "HBM ecosystem coordination" 3. "power delivery innovation (SiC, GaN PMICs, rack-level power architectures)" 4. "CPO/photonics integration capability" 5. "data center infrastructure as a “hidden limiter” to semiconductor revenue realization" As you probably know, I'm probably most bullish on memory/photonics like Sk Hynix/Samsung, $SNDK, $MU, $LITE above. And $TSM. I probably go a bit more upstream like $AXTI for InP precursors, but midstream players are the chokepoint + control most of the pricing. But just added commentary of related companies to topics to make things simpler for the regular retail investor.
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• 2026-01-24中性原文
  The potential SiC (Silicon Carbide) Interposer bottleneck stack for $NVDA Rubin and Hyperscaler ASICs (if you didn't like $WOLF): Downstream SiC: $TSM - SiC for CoWoS interposers $AMKR - S-SWIFT packaging for SiC integration $ASX- VIPack platform and optical integration. SiC Midstream: $KLAC - SiC defect inspection $ONTO - Panel-level packaging + inspection $AMAT - SiC deposition $AEHR - SiC inspection $ENTG - CMP $BESI (AS) - Hybrid Bonding equipment Disco - 70-80% marketshare precision cutting SiC Wafers: $WOLF - 300mm SiC wafers. $COHR - 150mm and 200mm SiC, still developing SK Siltron CSS (KRX: 034730) - Building to 200mm Resonac (4004 TYSE) - SmartSiC bonding NGK Insulators - Crystal growth Kyocera - SiC and ceramic packaging These are all early supply chain + active research. So when does this timeline hit? 2025-2026 (Blackwell Ultra): Continued reliance on Silicon Interposers 2027 (Rubin / Rubin Ultra): Introduction of SiC interposers in the highest-end AI SKUs. 2028+: Glass Substrates/SiC/Diamond Interposers? Disclosure: I own $AMKR, $AEHR, $ONTO, $COHR and $TSM above.
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• 2026-01-22中性原文
  Memory Supercycle Supply Chain TLDR: US Sleeper HBM4/Memory alpha picks that benefit from $MU and SK/Samsung: $VECO ($2B) -Laser annealing $PLAB ($2.1B) - Lithography photomask $ADEA ($2.18B) - Hybrid bonding $ACLS ($2.9B) - Ion implantation $FORM ($6.43B) - HBM wafer testing $ONTO ($10.6B) - Packaging metrology $AMKR ($13.1B) -Advanced packaging $RMBS ($13.55B) - Memory IP $MKSI ($14.9B) - Laser subsystems Didn't include big players like $TER and $KLAC since just wanted to focus on lesser known ones. There's some indirect beneficiaries too like $SMTC and $MTSI. Markets definitely haven't priced some of these in yet. Let me know if I missed any. Just wanted to publish these in case you find any of them interesting.
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